Printed Circuit Assemblys in Smart Grid Technology
When you press a button on your computer, mobile phone or MP3 player, you’re transmitting electrical signals to and from the device. These signals are the lifeblood of our digital world, and printed circuit boards are their internal organs. Whether you know it or not, PCBs are responsible for the smooth operation of our most critical and complex electronic devices.
A printed circuit assembly, also known as a PCB or PWB, is a laminated sandwich structure of conductive and non-conductive layers. The base material, called a substrate, makes the PCB rigid and firm, while the outer layers are made of either an insulating or semi-conductive copper. Each working side of the PCB features a pattern of conductive copper wires that are etched into the base material.
The etching process is a complex, maze-like operation that involves the careful coordination of many factors, such as component mapping and placement, keeping copper to board ratios even to reduce waste and prevent warping, and making sure distances between tracks are sized appropriately to accommodate signal frequency and current. As technology continues to become increasingly compact and intricate, the demands on PCB engineers are only increasing.
The Role of Printed Circuit Assemblys in Smart Grid Technology
While older PCBs could be modified by simple rewiring, the emergence of smaller components made this impractical and time-consuming. As a result, the development of a dedicated assembly process for PCBs became necessary.
During the printed circuit assembly process, a technician manually assembles and fastens components to specific areas of the bare board. This step is incredibly important, since even the slightest deviation from the original design specifications can have a significant impact on the function of the finished product.
Before the assembly process begins, the bare board is coated with a layer of solder paste to prepare it for the components. The solder paste is then used to attach the component’s pins to corresponding conductive pads or “lands” on the surface of the board, either through-hole technology or, more commonly, with surface-mount technology (SMT).
Once the solder paste has been applied, the board is ready for the next phase of the assembly. A trained assembler then places the component on top of the lands, matching their locations to the PCB’s CAD drawings and ensuring that all parts are set in the correct position to perform their intended functions.
A variety of other electronic and electrical components are added to the PCB during this step, depending on the circuit design. These may include things like capacitors, resistors, diodes and fuses. If the PCB contains RF (radio-frequency) components, their placement is especially crucial, as their performance can be severely impacted if they’re placed incorrectly.
Once the bare board is populated with its required components, it’s ready for testing and production. The final step is to test the assembled product using specialized tools and equipment to make sure it works properly. This is a vital stage in the process, as it’s the only way to catch any errors before they’re passed on to customers.